Our Wire Mesh Cable Trays are engineered to meet the demanding needs of modern data centers, IT facilities, and high-density cabling environments. They provide an open and organized pathway for power and data cables, ensuring efficient management without restricting airflow. This design helps prevent overheating and supports the long-term reliability of sensitive IT infrastructure.
One of the key advantages of wire mesh trays is their adaptability during installation. The lightweight construction makes them easy to cut, bend, and shape directly on-site, reducing the need for additional fittings and saving installation time. Despite being lightweight, they offer high load-bearing strength and are capable of handling dense bundles of cables without deformation.
These trays are manufactured in a wide range of materials and finishes, including mild steel, hot-dip galvanized steel, stainless steel (SS304/SS316), and powder-coated options. The smooth wire surface (Ra ≤ 3.2 μm) minimizes friction, ensuring cables can be pulled without damage. Their open structure allows for easy maintenance, quick modifications, and simple cable additions, which are essential in fast-changing data center environments.
Available Sizes
- Width: 50mm to 600mm
- Height: 50mm (standard)
- Length: 2500mm (standard)
- Wire Diameter: 4mm – 6mm
- Custom sizes can be manufactured on request
Technical Data
- Surface Roughness (Ra): ≤ 3.2 μm for cable protection
- Flow: ~70% open area for natural cooling
- Load Capacity: Up to 200 kg/m (depending on span and tray width)
- Finishes: Electro-galvanized, Hot-dip galvanized, Stainless Steel (304/316), Powder-coated
- Operating Temperature: -40°C to +120°C
- Earthing/Bonding: Conductive structure allows easy grounding
Because of the features, our wire mesh cable trays offering an ideal balance of strength, flexibility, and technical reliability. They are suitable for underfloor, overhead, and wall-mounted applications, giving data center designers maximum freedom to optimize space and cooling efficiency.
